Physical vapor deposition
We develop and optimize PVD processes for complex materials, intricate substrate geometries, and demanding performance environments. Current research includes:
- Designing and implementing custom coating systems
- Developing novel magnetron sputtering and evaporation processes
- Fabricating hollow spherical shells from low-atomic-mass materials, including beryllium, boron carbide, and diamond-like carbon
- Investigating ultrathick film deposition by energetic condensation
Plasma diagnostics
A central focus of our work is the in-depth characterization of plasmas and their interaction with growing films. We employ in situ plasma diagnostics to:
- Measure temporally-resolved energy distributions of the ions and neutrals bombarding the film surface during growth
- Relate plasma parameters to the film’s microstructure, stress, and defect formation
- Support the design of bespoke deposition sources for improved process control
- Develop models that connect plasma discharge conditions to coating properties
These efforts enable predictive control of PVD processes and accelerate the development of deposition recipes for new material systems and substrate configurations.
Advanced characterization
To better understand and control thin film performance, we couple advanced deposition and plasma diagnostics with a broad suite of both in-situ and ex-situ material characterization techniques. Research in this area includes:
- Correlating high-energy ion beam analysis, x-ray methods, and microscopy with process conditions
- Using x-ray computed tomography for the 3D metrology of coatings on non-planar substrates such as spheres and sphero-cylinders.
- Applying spectroscopy and surface analytical tools to probe bonding, defects, and interfaces
- Combining both in-situ and ex-situ stress measurements with microstructural analysis to better understand film growth processes
